At the Aicomp Summit 2026, the latest technical developments and findings in the field of software for the packaging industry will be presented in lectures and technically demanding workshops. This information is relevant for both packaging manufacturers and digitalization partners.
After the great success of the Aicomp Summit 2024 in Berlin, the event will take place in Vienna for the first time in 2026. From March 11-13, 2026, interested parties will learn more about digitalization in the packaging industry at the 25hours Hotel in Vienna’s Museum Quarter.
Shaping the future of the packaging industry: Exchange on innovation and optimization at the Aicomp Summit
In 2021, the internationally renowned IT company Aicomp launched the first Aicomp Summit. The event is aimed at specialists and executives from the IT industry – with a special focus on the packaging industry – and offers a platform for exchange on new technologies and ways to increase the efficiency of industrial processes. Aicomp’s goal is to help shape the future of the packaging industry in a sustainable way through innovation and continuous optimization.
The 2026 event will focus on the latest developments in artificial intelligence and sustainable production. Aicomp itself focuses on key topics in product configuration and how these optimizations are made possible in all areas of the company. In addition, completely new technological approaches, such as AI-supported production planning and cloud-based SaaS solutions for data management and corporate control, will be explained and discussed in detail.
Partnerships in focus: Aicomp expands its network with industry leaders
Aicomp focuses on the continuous expansion of its partner network and therefore brings together numerous partner companies to present relevant solutions at the summit. Among the partners represented are well-known companies such as SAP, OMP, ORTEC and T.CON.
These partners will present their current technologies and solutions to meet the specific requirements of the packaging industry. SAP will show approaches on how existing systems can be gradually developed for building a smarter company – especially in the context of modern production planning. OMP focuses on optimizing the supply chain along the entire value chain – from production planning to manufacturing. ORTEC will present innovative solutions for efficient transport and route planning. T.CON focuses on the development of untapped production potential and shows how modern SAP technologies can be integrated into existing system landscapes in a targeted manner.
In this way, Aicomp and its partners contribute to the further development and improvement of the packaging industry through cooperation and the exchange of technologies and solutions.
Insights into the digitalization strategies of well-known packaging manufacturers
Some of the largest and most established packaging companies are also supporting the summit with their valuable insights. Participants include renowned Aicomp customers such as Mondi and MM Group, as well as other leading packaging manufacturers such as Gatner Packaging, who will share their extensive experience in digitalization with those present. These companies present their digitalization strategies and development approaches in a vivid way and provide exciting insights into their processes for overcoming the everyday challenges of their industry.
In compellingly designed lectures and discussion panels, they will explain their proven approaches to meeting the requirements of digitization and implementing technical optimizations in their operations.
Global Knowledge Exchange: Aicomp Summit – Live Event in Vienna and Stream
The event is an English-moderated event that is open to all interested parties after prior registration. On-site participation in Vienna can be booked for 650 euro per participant. For those who cannot attend on site, the event will be livestreamed free of charge. All that is required is user access to the Aicomp Summit Website. In addition, the individual lectures will also be made available retrospectively via the website and can be accessed after logging in.
The three-day format, with over 30 live sessions and more than 20 speakers, offers an even more immersive learning experience than previous years. In addition to keynote lectures and panel discussions, deep-dive sessions and interactive breakout formats will also be offered, promoting direct exchange between participants.
Networking: Where packaging experts meet technology professionals and ideas flow
The Aicomp Summit event offers a diverse framework that brings together stakeholders from the packaging industry and creates the opportunity to establish new networks. This is where technology experts with extensive industry knowledge and many years of experience meet experienced experts from the packaging industry. This unique gathering makes the Summit an outstanding knowledge and exchange platform where innovative ideas and best practices merge.
The success of the Summit 2024 in Berlin with 100% participant satisfaction and 77% “very satisfied” and 23% “satisfied” ratings underlines the quality and relevance of the format. This track record motivates Aicomp to take the 2026 event in Vienna to a new level.
